Go to journal home page - Microelectronics Reliability

Microelectronics Reliability

Submit your articleGuide for authors

About the journal

Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the …

$2280

Article publishing charge
for open access

87 days
Review time
96 days
Submission to acceptance
View all insights

Editor-in-Chief

View full editorial board
Photo of Dr. Bongtae Han

Dr. Bongtae Han

University of Maryland at College Park, Department of Mechanical Engineering, 2181 Glenn L. Martin Hall, Building 088, 20742-0001, College Park, Maryland, United States of America, Fax: 301-314-9477

Articles

Research articleAbstract only

Study on the single event reliability of a Pavlov system based on neuron chip

Guangbo Mao, ... Guanghua Du
May 2024
Research articleAbstract only

Evaluating the performance of 6T SRAM cells by deep learning

Parsa Khorrami, Abdolreza Nabavi
May 2024
Research articleAbstract only

Mechanism of electrical performance deterioration in a-Si:H TFTs caused by source/drain Decap treatment

Wenxiang Chen, ... Liang Fang
May 2024
Research articleAbstract only

Epitaxial hillocks defects caused by subsurface damage from InAs substrate

Lijie Liu, ... Wei Lu
May 2024
Research articleAbstract only

Designing a Deep Neural Network engine for LLC block reuse prediction to mitigate Soft Error in Multicore

Avishek Choudhury, ... Biplab K. Sikdar
May 2024
Research articleAbstract only

Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages

Borja Kilian, ... Martin Schneider-Ramelow
May 2024
Research articleAbstract only

Comparative study on the short-circuit withstand capability between the superjunction and conventional field-stop IGBTs

Zhihao Wang, ... Jianlin Zhou
May 2024
Research articleAbstract only

Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method

Xinyi Jing, ... Shuye Zhang
May 2024
Read latest issue

More from Microelectronics Reliability

View all news

Calls for papers

Reliability and Failure Physics: selected papers from the ESREF 2024 Conference

Guest editors: Francesco Iannuzzo, Giovanna Mura, Paolo Cova - Submission deadline: 15 November 2024
This special issue of Microelectronics and Reliability comprises a selection of papers presented during the 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2024, at Parma (Italy) from September 23rd …
Submission deadline: 15 November 2024
View all calls for papers for special issues

Special issues and article collections

View all special issues and article collections
View all issues
Print ISSN: 0026-2714
Online ISSN: 1872-941X

Copyright © 2024 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.

For authors
Resources for authorsTrack your accepted paperJournal FinderResearcher AcademyRights and permissionsJournal Article Publishing Support Center
For editors
Resources for editorsPublishing Ethics Resource KitGuest editors
For reviewers
Resources for reviewersReviewer recognition